HTC One 2 release date is happening in Mar. 25 as the handset was spotted in a teaser video.
HTC's upcoming flagship phone also known as HTC One Up will be released on Mar. 25 in Beijing, China. Although the announcement is weeks away, consumers already had an idea of what the handset will look like.
However, it has not stopped the Taiwanese manufacturer in releasing a new teaser trailer for the upcoming handset. The company upgraded the overall design and quality of the device. The latest trailer hinted that the smartphone will come with metal unibody just like the previous HTC One.
According to the video, HTC claimed that the metal casing adds strength and durability to the smartphone. Consumers should expect more teasers and trailers from HTC as the release date inches closer.
Watch the video of HTC One Up below.
*Video from YouTube/HTC
Alleged photos of HTC One Up surfaced online thanks to reliable tipster @evleaks. The Twitter user is considered as a credible source of leaks and tips. The images showed a slate gray HTC One with Verizon branding and a white model labelled with the AT&T logo. Thus, this means that consumers can avail the smartphone from the aforementioned carriers.
Surprisingly, the leaked photos were similar to the gold version of HTC One that emerged a couple of weeks ago. Rumours said that handset will sport a dual camera lenses, a dual-LED flash and twin BoomSound speakers. Also, the upcoming smartphone may have a slimmer bezel compared to the previous HTC One and the keys were moved to the display.
Furthermore, HTC One Up is reported to pack new features such as dual camera, Kitkat OS and fingerprint sensor. It was heavily rumoured that the next generation of HTC One will pack two cameras at the back. HTC was already rolling out the latest Android OS update to previous HTC handsets. Thus, it is most likely HTC's new handset will pack the new operating system from Google - Android 4.4.2 Kitkat OS. Lastly, HTC One Max already packed a fingerprint sensor. There is a big chance that HTC One 2 will pack the same technology but improve its features.