iPhone 6 release date may come as early as June as the production of A8 processor has just begun, according to a report.
DigiTimes reported Apple has tasked three semiconductor product packaging companies to provide adequate supply for the next-generation "A8″ mobile processor for the upcoming line of iOS devices, starting with the iPhone 6.
This triad of companies are Amkor Technology, STATS ChipPAC and Advanced Semiconductor Engineering, which will all handle packaging of the processor likely to power Apple's next iPhone and other iDevices.
Moreover, Taiwan Semiconductor Manufacturing Company (TSMC) is believed to have bumped the wafer for the successor of A7 processor. Apple and Samsung signed TSMC on as a third processor-making partner in December 2013. TMSC is expected to ramp up the production in the second quarter using 20 nm process technology. The A8 chipset is seen to deliver even more power for Apple's future line of iPhones and the next iPad and future iPad mini.
Other confirmed features that will most likely to arrive in the next iPhone are iOS 8 and fingerprint sensor. It is reported iPhone 6 will be released alongside the new version of Apple's operating system at the Worldwide Developers Conference in June. iOS 8 will come with new software features. iPhone 6 will most likely to retain its fingerprint sensor but packed with new functions and capabilities. However, Apple has not released the official details of what consumers should expect to the upcoming smartphone.
Moreover, Apple patents hinted on some of the possible specifications of iPhone 6 such as a curved or flexible screen embedded by durable material called liquidmetal and reinforced by Sapphire glass covering, an improved Siri and gestures control.
Regarding the iPhone 6 release date, Apple has not revealed any concrete date yet. Waiting fans continue to speculate on the possible arrival of the device. Some reports noted the handset will come in summer, while other reports said the smartphone will arrive in September.
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