Sony Xperia SP Smartphone Specs Leaked Ahead of MWC 2013: report

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By Rohit KVN | February 22, 2013 10:59 PM EST

In the countdown to the international mobile convention MWC (Mobile World Congress) 2013 event, many rumours of new devices are beginning to surface in the online media.

Now a smartphone community website 'XperiaBlog' citing information from a reliable source has revealed leaked features of Sony's upcoming smartphone Xperia SP.

Leaked Specs of Sony Xperia SP Include:

Model

Sony Xperia SP

Codename: HuaShan

(Model no: C5303X)

Display

4.6-inch display with

720p HD display

Processor

Dual-core processor with

1.7Ghz CPU speed

(Chipset: Qualcomm Snapdragon

S4 Pro MSM8960T)

GPU

Adreno 320 graphics

memory

8GB, storage expandable using microSD

card

Camera

8.0-megapixel rear camera with Exmos RS

sensor

Dimensions

130.6 x 67.1 x 9.98 mm

Weight

155 g


The speculated Sony Xperia SP will share the stage with other smartphone makers such Nokia, LG and Samsung to launch their devices at the upcoming international convention MWC 2013 next week.

Finnish handset maker Nokia is reportedly planning to launch two mid-range devices - Lumia 520 and 720 - as well as high-end camera smartphone called Lumia 1000.

Samsung's Galaxy Star and LG's Optimus L7-II, L5-II and L3-II are also pegged to launch in the MWC 2013.

MWC 2013 is scheduled to take place in Barcelona, Spain during 25-28 February.

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